A ceramic diamond whetstone specifically designed for grinding and polishing of highly hard materials.
Very high grinding ability, and it finishes the surface uniformly while smoothly removing the hardened layer after electric discharge processing.
Unlike the structure of conventional ceramic whetstones, because diamond abrasive grains are contained in the alumina fibers with high homogeneity, this enables greatly efficient grinding and polishing work on carbide and workpieces of quenched steel with a hardness of HRC60 or above.
ข้อมูลสินค้า
Grain Size (#) : 200
Color : Black
L x W x Thickness (mm) : 100 x 10 x 1
น้ำหนัก
3 g
การใช้งาน
Electric discharge machining and surface finishing after cutting.
