Polyimide tape using special acrylic based adhesive.
As non-silicone based adhesive is used, optimum for use, in which siloxane gas and silicone transition are worried, such as heat resistant masking during solder re-flow of electronic circuit board, temporary fixing, part protection, sealing of through holes, and protecting lenses.
As the adhesion layer is thin and the initial adhering force is low, optimum for surface protection of glass and optics parts.