Polyimide tape using special acrylic based adhesive.
As non-silicone based adhesive is used, optimum for use, in which siloxane gas and silicone transition are worried, such as heat resistant masking during solder re-flow of electronic circuit board, temporary fixing, part protection, sealing of through holes, and protecting lenses.
As glue residues are little on epoxy resin, suitable for production processes of molding use on tape etc.
ข้อมูลสินค้า
Color : Brown
W x L (mm x m) : 19 x 50
Thickness (mm) : 0.03
Viscosity : 0.41N/10mm
Responds to re-flow.
Heat resistance : 260°C for 30 minutes
With release film
วัสดุ
Base Material : Polyimide Film
Adhesive : High heat resistant and cross-linkable acrylic based